Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days |
| Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | Green |
| Material | FR4 Material |
| Layer | Multilayer |
| Board Size | 11*9cm |
| Copper Thinknes | 1 oz |
| Min Line Width | 4 mil |
| Min Line Space | 4mil |
| Surface Finish | Immersion Tin |
| Name | FR4 pcb |
| Brand Name | XCE |
| Model Number | XCE Bh700 |
| Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days | Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | Green | Material | FR4 Material |
| Layer | Multilayer | Board Size | 11*9cm |
| Copper Thinknes | 1 oz | Min Line Width | 4 mil |
| Min Line Space | 4mil | Surface Finish | Immersion Tin |
| Name | FR4 pcb | Brand Name | XCE |
| Model Number | XCE Bh700 | Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | single sided pcb board ，pcb circuit board | ||
High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :11*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin
Features:
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
Parameter:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Data :
| Layer | 1 to 28 layers |
| Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness | 0.21mm to 7.0mm |
| Copper thickness | 0.5 OZ to 7.0 OZ |
| Copper thickness in hole | >25.0 um (>1mil) |
|
Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) | |
| Min. Line Width: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
|
Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
|
Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
|
• High Decomposition Temperature (Td) (> 325º C)
• Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 4)
• Compatible with standard and lead-free assembly.
• Laminate thickness available from 0.005” to 0.125”
• Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
Typical Applications:
Production Description :
|
|---|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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