Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 |
| Layer | 6 |
| Color | Green |
| Min line space | 5mil |
| Min line width | 5mil |
| Copper thickness | 2OZ |
| Board size | 8*6cm |
| Panel | 1 |
| Surface | ENIG |
| Brand Name | XCE |
| Model Number | XCE MN |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 | Layer | 6 |
| Color | Green | Min line space | 5mil |
| Min line width | 5mil | Copper thickness | 2OZ |
| Board size | 8*6cm | Panel | 1 |
| Surface | ENIG | Brand Name | XCE |
| Model Number | XCE MN | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | pcb maker ，printed circuit board manufacturing | ||
Fr4 High TG Pcb 6 Multi Layered Pcb Custom Printed Circuit Board Pcb
Quick detail:
| Origin:China | Special: 2 raw material mix compression |
| Layer:4 | Thickness:1.2mm |
| Surface: ENIG | Hole:0.8 |
Specification:
FR4 materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, FR4 pcb is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
FR4 materials are UL 94V-0 rated for active devices and high power RF designs.
Typical Applications
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
| Brand | Model | Thickness(mm) | DK(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
| RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
| RO5880 | 0.254.0.508.0.762 | 2.2 | |
| RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
| RO3010 | 0.635 | 10.2 | |
| RO3206 | 0.635MM | 10.2 | |
| R03035 | 0.508MM | 3.5 | |
| RO6010 | 0.635MM, 1,27MM | 10.2 |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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