Foisontech Corporation Co., Limited
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 1-18 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | HASL |
| Solder Mask | Green |
| Board Size | 800 * 508 Mm |
| Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.075/0.075mm |
| Brand Name | FOISON |
| Model Number | FSD0002L06006 |
| Certification | SGS, UL, RoHs, |
| Place of Origin | Shenzhen,China |
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Product Specification
| Payment Terms | T/T, Western Union, L/C | Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days | Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 | Layer Count | 1-18 Layer |
| Board Thickness | 1.6MM | Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | HASL | Solder Mask | Green |
| Board Size | 800 * 508 Mm | Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.075/0.075mm | Brand Name | FOISON |
| Model Number | FSD0002L06006 | Certification | SGS, UL, RoHs, |
| Place of Origin | Shenzhen,China |
HASL Industrial PCB board 1oz ( 35um ) Copper Thickness, Rigid pcb with SMT
1.Rigid pcb with smt,dip assembled
2.Automatic smt,dip lines for assembly
3.AOI,X-ray test,Function test
4.7-10 days
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-18 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2 |
| 3 | Board thickness | 0.2mm-4mm |
| 4 | Max.finished board side | 800*508mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | min.line width | 0.075mm(3mil) |
| 7 | min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Chemical tin,Chemical Gold, Immersion gold Immersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,CQC |
| 15 | profiling punching | Routing,V-CUT,Beveling |
| 16. providing OEM service to all sorts of printed circuit board assembly | ||
Detailed Terms for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quote requirement:
OEM/ODM/EMS Services for PCBA:
Orientronic PCB assembly Equipment:
| PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer | ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
| Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
| Thickness | 0.2～3.2mm | |
| Production Type | Layer Count | 2L-16L |
| Surface Treatment | HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL | |
| Cut Lamination | Max. Working Panel size | 1000×1200mm |
| Inner Layer | Internal Core Thickness | 0.1～2.0mm |
| Internal width/spacing | Min: 4/4mil | |
| Internal Copper Thickness | 1.0~3.0oz | |
| Dimension | Board Thickness Tolerance | ±10% |
| Interlayer Alignment | ±3mil | |
| Drilling | Manufacture Panel Size | Max: 650×560mm |
| Drilling Diameter | ≧0.25mm | |
| Hole Diameter Tolerance | ±0.05mm | |
| Hole Position Tolerance | ±0.076mm | |
| Min.Annular Ring | 0.05mm | |
| PTH+Panel Plating | Hole Wall copper Thickness | ≧20um |
| Uniformity | ≧90% | |
| Outer Layer | Track Width | Min: 0.08mm |
| Track Spacing | Min: 0.08mm | |
| Pattern Plating | Finished Copper Thickness | 1oz～3oz |
| EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
| Gold Thickness | 0.03~0.05um | |
| Solder Mask | Thickness | 15～35um |
| Solder Mask Bridge | 3mil | |
| Legend | Line width/Line spacing | 6/6mil |
| Gold Finger | Nickel Thickness | ≧120u〞 |
| Gold Thickness | 1～50u〞 | |
| Hot Air Level | Tin Thickness | 100～300u〞 |
| Routing | Tolerance of Dimension | ±0.1mm |
| Slot Size | Min:0.4mm | |
| Cutter Diameter | 0.8～2.4mm | |
| Punching | Outline Tolerance | ±0.1mm |
| Slot Size | Min:0.5mm | |
| V-CUT | V-CUT Dimension | Min:60mm |
| Angle | 15°30°45° | |
| Remain Thickness Tolerance | ±0.1mm | |
| Beveling | Beveling Dimension | 30～300mm |
| Test | Testing Voltage | 250V |
| Max.Dimension | 540×400mm | |
| Impedance Control | Tolerance | ±10% |
| Aspect Ration | 12:1 | |
| Laser Drilling Size | 4mil(0.1mm) | |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable | |
| OEM&ODM Service | Yes | |
How to get quick quotation?
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
| Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others | ||||||||||||||||||||
| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
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If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
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| SAMPLE:
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| Layer count | Sample lead time/workday | Batch lead time/workday |
| 1-2L | 2 | 6 |
| 4L | 5 | 8 |
| 6L | 5 | 9 |
| 8L | 6 | 10 |
| 10L | 8 | 10 |
| 12L | 8 | 12 |
| 14L | 10 | 15 |
| 16L | 10 | 18 |
| 18-40L (Up to difficulty) | at least 18 | at least 24 |
| P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays | ||
Q1: I am used to designing in metric units while the website is specified in imperial units.
A: When requesting an online quote, the quote form can handle mm units as well as inches for dimensions.
Q2: How do I specify internal cutouts/milling in my design?
A: All internal cutouts/slots/milling should be specified on the same layer is the board outline. The the minimum routable slot size is 32 mils. During order time, please state this requirement in the "Special Request" section so that our CAM engineers is aware of it. This is not something we encounter.
Q3: What are the available holes sizes?
A: 14 mils to 150 mils - 1 mil increments 150 mils to 200 mils - 5 mil increments above 200 mils - holes would be routed out We only use drills in imperial units. Files submitted in metric units (mm) would be converted to imperial units (mils) and rounded up to the next mil.
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Consideration about PCB fabrication
When placed an order of PCBs (printed circuit boards), you should spend time to considerate the basic factors including PCB board substrate material, layer count, board size, board thickness, copper thickness, surface finish, solder mask, silkscreen, blind vias, buried vias, through-hole plating, SMT and so on. When all the factors are checked and confirmed with the engineers, we highly recommended sample tested before the real fabrication of your PCB boards. If all things go well, fabrication could be started right away. However, it may need to do some modification if customer is not satisfied with the sample.
Company Details
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
2000,000-3000,000
Employee Number:
200~300
Ecer Certification：
Active Member
Established in 2005, Foisontech Corporation Co.,Ltd. is a professional PCB manufacturer, which specialized in manufacturing Single-Sided Boards, Double-Sided Boards and multilayer PCB, up to 32 layers; also could provide turnkey PCB assembly service. FOISON PCB monthly capability can re... Established in 2005, Foisontech Corporation Co.,Ltd. is a professional PCB manufacturer, which specialized in manufacturing Single-Sided Boards, Double-Sided Boards and multilayer PCB, up to 32 layers; also could provide turnkey PCB assembly service. FOISON PCB monthly capability can re...
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