Foisontech Corporation Co., Limited
Products
Manufacturer of a wide range of products which include Immersion Gold Multilayer PCB Board For Vehicle Green Solder Mask OEM,HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated,Green Solder Mask Prototyp...
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 4 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 280 * 233.35 Mm |
| Min. Aperture | 0.4MM |
| Min. Line Trace Width/Space | 0.2/0.2mm |
| Brand Name | FOISON |
| Model Number | FSD0002L060 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 10 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 60 * 52 Mm |
| Min. Aperture | 0.4MM |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L0888 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 20 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 300 * 210 Mm |
| Min. Aperture | 3Mil |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L06666 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 10 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 60 * 37 Mm |
| Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.076/0.076mm |
| Brand Name | FOISON |
| Model Number | FSD0002L060 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 6 Layer |
| Board Thickness | 2.0MM+/-10% |
| Copper Thickness | 2 Oz |
| Surface Treatment | ENIG |
| Solder Mask | Red |
| Board Size | 94 * 88 Mm |
| Min. Aperture | 0.30MM |
| Min. Line Trace Width/Space | 8Mil/8Mil |
| Brand Name | FOISON |
| Model Number | FSD0002L060 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
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