XC9572XL-10VQG44C Programmable IC Chips new & original High Performance CPLD

Product Specification

 
XC9572XL High Performance CPLD
 
Features
• 5 ns pin-to-pin logic delays
• System frequency up to 178 MHz
• 72 macrocells with 1,600 usable gates
• Available in small footprint packages
  - 44-pin PLCC (34 user I/O pins)
  - 44-pin VQFP (34 user I/O pins)
  - 48-pin CSP (38 user I/O pins)
  - 64-pin VQFP (52 user I/O pins)
  - 100-pin TQFP (72 user I/O pins)
  - Pb-free available for all packages
• Optimized for high-performance 3.3V systems
  - Low power operation
  - 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V signals
  - 3.3V or 2.5V output capability
  - Advanced 0.35 micron feature size CMOS Fast FLASH™ technology
• Advanced system features
  - In-system programmable
  - Superior pin-locking and routability with Fast CONNECT™ II switch matrix
  - Extra wide 54-input Function Blocks
  - Up to 90 product-terms per macrocell with individual product-term allocation
  - Local clock inversion with three global and one product-term clocks
  - Individual output enable per output pin
  - Input hysteresis on all user and boundary-scan pin inputs
  - Bus-hold circuitry on all user pin inputs
  - Full IEEE Standard 1149.1 boundary-scan (JTAG)
• Fast concurrent programming
• Slew rate control on individual outputs
• Enhanced data security features
• Excellent quality and reliability
  - Endurance exceeding 10,000 program/erase cycles
  - 20 year data retention
  - ESD protection exceeding 2,000V
• Pin-compatible with 5V-core XC9572 device in the 44-pin PLCC package and the 100-pin TQFP package
WARNING: Programming temperature range of TA = 0° C to +70° C
 
Description
The XC9572XL is a 3.3V CPLD targeted for high-performance, low-voltage applications in leading-edge communications and computing systems. It is comprised of four 54V18 Function Blocks, providing 1,600 usable gates with propagation delays of 5 ns. See Figure 2 for overview.
 
Power Estimation
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell in a XC9500XL device may be configured for low-power mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power. For a general estimate of ICC, the following equation may be used:
ICC(mA) = MCHS(0.175*PTHS + 0.345) + MCLP(0.052*PTLP + 0.272) + 0.04 * MCTOG(MCHS +MCLP)* f
where:
MC_HS = # macrocells in high-speed configuration
PT_HS = average number of high-speed product terms per macrocell
MC_LP = # macrocells in low power configuration
PT_LP = average number of low power product terms per macrocell
f = maximum clock frequency
MCTOG = average % of flip-flops toggling per clock (~12%)
This calculation was derived from laboratory measurements of an XC9500XL part filled with 16-bit counters and allowing a single output (the LSB) to be enabled. The actual ICC value varies with the design application and should be verified during normal system operation. Figure 1 shows the above estimation in a graphical form. For a more detailed discussion of power consumption in this device, see Xilinx application note XAPP114, “Understanding XC9500XL CPLD Power.”
 
Figure 1: Typical ICC vs. Frequency for XC9572XL

 
Absolute Maximum Ratings⁽²⁾

Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to –2.0 V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA. External I/O voltage may not exceed VCCINT by 4.0V.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free packages, see XAPP427.
 
Figure 2: XC9572XL Architecture

 
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