TC4420CPA high power mosfet transistors Power Mosfet Transistor 6A HIGH-SPEED

Product Specification

TC4420

TC4429

6A HIGH-SPEED MOSFET DRIVERS

FEATURES

■ Latch-Up Protected ............ Will Withstand >1.5A Reverse Output Current

■ Logic Input Will Withstand Negative Swing Up to 5V

■ ESD Protected ..................................................... 4kV

■ Matched Rise and Fall Times ...................... 25nsec

■ High Peak Output Current ......................... 6A Peak

■ Wide Operating Range .......................... 4.5V to 18V

■ High Capacitive Load Drive ......................10,000pF

■ Short Delay Time ................................. 55nsec Typ.

■ Logic High Input, Any Voltage ............. 2.4V to VDD

■ Low Supply Current With Logic "1" Input ... 450µA

■ Low Output Impedance .................................... 2.5Ω

■ Output Voltage Swing to Within 25mV of Ground or VDD

APPLICATIONS

■ Switch-Mode Power Supplies

■ Motor Controls

■ Pulse Transformer Driver

■ Class D Switching Amplifiers

GENERAL DESCRIPTION

The TC4420/4429 are 6A (peak), single output MOSFET drivers. The TC4429 is an inverting driver (pin-compatible with the TC429), while the TC4420 is a non-inverting driver. These drivers are fabricated in CMOS for lower power, more efficient operation versus bipolar drivers.

Both devices have TTL-compatible inputs, which can be driven as high as VDD + 0.3V or as low as – 5V without upset or damage to the device. This eliminates the need for external level shifting circuitry and its associated cost and size. The output swing is rail-to-rail ensuring better drive voltage margin, especially during power up/power down sequencing. Propagational delay time is only 55nsec (typ.) and the output rise and fall times are only 25nsec (typ.) into 2500pF across the usable power supply range.

Unlike other drivers, the TC4420/4429 are virtually latch-up proof. They replace three or more discrete components saving PCB area, parts and improving overall system reliability.

ABSOLUTE MAXIMUM RATINGS*

Supply Voltage ......................................................... +20V

Input Voltage ............................................... – 5V to > V_DD

Input Current (V_IN > V_DD) .........................................50mA

Power Dissipation, (T_A ≤ 70°C)

      PDIP ...............................................................730mW

      SOIC ...............................................................470mW

      CerDIP ............................................................800mW

      5-Pin TO-220 ......................................................1.6W

Package Power Dissipation, T_C ≤ 25°C

      5-Pin TO-220 (With Heat Sink) .........................12.5W

Derating Factors (To Ambient)

      PDIP ............................................................. 8mW/°C

      SOIC ............................................................. 4mW/°C

      CerDIP ....................................................... 6.4mW/°C

      5-Pin TO-220 .............................................. 12mW/°C

Thermal Impedances (To Case)

      5-Pin TO-220 R_θJ-C ....................................... 10°C/W

Storage Temperature Range ................ – 65°C to +150°C

Operating Temperature (Chip) .............................. +150°C

Operating Temperature Range (Ambient)

      C Version ............................................... 0°C to +70°C

      I Version ........................................... – 25°C to +85°C

      E Version .......................................... – 40°C to +85°C

      M Version ....................................... – 55°C to +125°C

Lead Temperature (Soldering, 10 sec) ................. +300°C

*Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

PIN CONFIGURATIONS

FUNCTIONAL BLOCK DIAGRAM

PACKAGE DIMENSIONS

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