20W 50w Laser Scribing Machine , Fiber Laser Cutting Machine For Solar Cell

Product Specification

20W 50w Laser Scribing Machine , Fibre Laser Cutting Machine For Solar Cell

(Model:PE-20W/50W)

※Product Introduction of laser dicing silicon wafer

Perfect Laser produced a new generation of 20w 50W Solar cell fiber cutting machine mainly used for metal and silicon, germanium, gallium arsenide and other semiconductor material substrate scribing and cutting, machinable solar panels, silicon, ceramic , aluminum foil, etc., Artifacts refinement and blazonry, trimming smooth.  Silicon wafer machine adopting continuous pumping acousto-optic adjustable Q’s Nd: YAG laser as work light source, The two-dimensional work table of dicing wafer is controlled by computer,and could do kinds of movement according to what graphics be input in.High output power, high precision scribing, fast speed and could cut curve and straight line graph.

※Product Features of laser dicing silicon wafer

1. Software upgrade: support the arc interpolation,circular arc cutting more smoothly;

2. 20w 50W Solar cell fiber cutting machine upgrade: covers an area of space smaller after modification, operating more accord with human body engineering;

3. Refactoring workbench processing part, open-type workbench processing area, up-down material more convenient. Removed spare parts from the workbench tablet, higher precision and not easy to deformation

4. Improvement the screw parts: screw lead increased, so as to expedite the processing speed, guarantee machining accuracy;

5. Direct plug-in light path design, higher machining precision, better effect ;

6. Serve motor modification: run more smoothly, smaller cutting noise,more humanized design;

7. Authoritarian flat dust removal device, The processing effect is better;

8.Improved the laser signal control section, software runs more stable and fast.

※Product Advantage of laser dicing silicon wafer

1.The core parts adopt imported brand;

2.Fiber Laser has stronger adaptability to the environment;

3.Better beam quality(basic modeTEM000),thinner kerf width, more smooth edges;

4.Higher conversion efficiency, lower running cost, smaller equipment volume (air cooling);

5.The laser pulse width are more narrow, higher peak power, faster scribing speed;

6.[Battery Cell automatic adsorption ,don’t need pedal;]

7.For a long time continuous operation without maintenance, no consumable parts replacement;

8.Software upgrade to version 5.0,parameters of concentrated control, software configurations save;

9.Touch screen operation, serve motor driving(optional).

※Technical Parameter of laser dicing silicon wafer

※Application Field and Samples of laser dicing silicon wafer

Solar photovoltaic industry, monocrystalline silicon and polycrystalline silicon solar battery (cell) and silicon (wafer) of scribing processing (cutting section).

※Packaging & Delivery

1. Prompt deliver at the very day.

2. Well-trained and disciplined packing team.

3. After-sale service:. Any questions or problems after receiving the product, please feel free to contact us. Problems would be solved for you immediately.

4. Sophisticated and professional logistic agent.

※Competitive Advantages

1. 100% custom pass guaranteed.

2. Our products have been exported to Germany, Norway, Poland, Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia, Japan, Korea, Thailand, Indonesia, Uruguay and many other countries.

3. Flexible and Untraceable payment terms.

4. Good after-sale service.

5. We offer high quality products at competitive price in quick delivery.

20W 50w Laser Scribing Machine , Fiber Laser Cutting Machine For Solar Cell.pdf