Payment Terms | T/T |
Packaging Details | Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers. |
Surface Orientation | A-Plane(11-20) |
Material | High purity Al2O3(>99.995%) |
Thickness | 430 ±10μm |
R-plane | R9 |
Diameter | 50.8 ±0.10 |
Wafer edge | R-type |
Model Number | JDCD08-001-001 |
View Detail Information
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Product Specification
Payment Terms | T/T | Packaging Details | Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers. |
Surface Orientation | A-Plane(11-20) | Material | High purity Al2O3(>99.995%) |
Thickness | 430 ±10μm | R-plane | R9 |
Diameter | 50.8 ±0.10 | Wafer edge | R-type |
Model Number | JDCD08-001-001 | ||
High Light | EPI Ready Sapphire Substrate ,double side polished wafer 430um ,Sapphire Substrate Mirror Polished |
Thk 430μm 50mm Sapphire Substrate Wafer Wafer Edge R-Type Mirror Polished,EPI-Ready
JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 LED chip,substrate material
Sapphire is most suitable these days since a variety of semiconductors are being used in different devices. Digital communication products like smartphones, digital cameras, washing machines, LED bulbs, and refrigerators are making use of semiconductors.
There are also very few electronic devices that are devoid of integrated circuits. As time goes by, more developments will take place in the field of sapphire substrates.
Parameters |
Specification | ||
Unit | Target | Tolerance | |
Material | High purity Al2O3(>99.995%) | ||
Diameter | mm | 50.8 | ±0.10 |
Thickness | μm | 430 | ±15 |
Surface Orientation | C-Plane(0001) | ||
-Off Angle toward M-axis | degree | 0.20 | ±0.10 |
-Off Angle toward A-axis | degree | 0.00 | ±0.10 |
Flat Orientation | A-Plane(11-20) | ||
-Flat Off-set Angle | degree | 0.0 | ±0.2 |
Flat Lenght | mm | 16.0 | ±1 |
R-plane | R9 | ||
Front surface Roughness(Ra) | nm | <0.3 | |
Back surface Roughness | μm | 0.8~1.2μm | |
Front surface Quality | Mirror Polished,EPI-Ready | ||
Wafer edge | R-type | ||
Chamfer amplitude | μm | 80-160 | |
Included angle radian between flat edge and round edge | mm | R=9 | |
TTV | μm | ≤5 | |
LTV(5x5mm) | μm | ≤1.5 | |
Bow | μm | 0~-5 | |
Warp | μm | ≤10 | |
Laser mark | As customer required |
About Us
We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.
FAQ
Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.
Company Details
Business Type:
Manufacturer
Year Established:
2020
Employee Number:
>100
Ecer Certification:
Verified Supplier
Shanghai GaNova Electronic Information Co., Ltd. is a company specialized in broadband semiconductor technology related materials, equipment, testing and analysis services and technical advice. Founded in 2020, we are a wholly-owned subsidiary of Suzhou Nanowin Technology Co., Ltd. Our team has prof... Shanghai GaNova Electronic Information Co., Ltd. is a company specialized in broadband semiconductor technology related materials, equipment, testing and analysis services and technical advice. Founded in 2020, we are a wholly-owned subsidiary of Suzhou Nanowin Technology Co., Ltd. Our team has prof...
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