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Shanghai GaNova Electronic Information Co., Ltd.

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Wafer Dicing Machine

Manufacturer of a wide range of products which include X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw,Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System,150mm Rapid Thermal Annealing System W...

Quality X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw for sale

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X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw

  1. MOQ: 1

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Delivery Time 8-10week days
Product Name DAD3350 Automatic Dicing Saw
Max. workpiece size Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application 1.8 kW, 2.2 kW
Machine weight Approx. 1,200kg
X-axis Cutting range 260mm
X-axis Cutting speed 0.1 ~ 600mm/s
Brand Name GaNova
Place of Origin Suzhou China

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Quality Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System for sale

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Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System

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Payment Terms T/T
Delivery Time 3 month
Maximum product size 8-inch and below wafers
Equipment dimensions 970mm x 1450mm x 2024mm (width x depth x height)
Heating temperature range Room temperature~~800 ℃ (thermocouple) 800 ℃~1250 ℃ (infrared pyrometer)
heating rate 150 ℃/s bare wafer 20 ℃/s silicon carbide carrier
Temperature uniformity < 500 ℃, uniformity ≤ ± 5 ℃ ≥ 500 ℃, uniformity ≤ ± 1%
Temperature control repeatability ±1℃
Constant temperature duration Programmable according to requirements
Brand Name Ganova
Model Number RTP-SA-8
Place of Origin China

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Quality 150mm Rapid Thermal Annealing System With Three Sets Process Gases for sale

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150mm Rapid Thermal Annealing System With Three Sets Process Gases

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Payment Terms T/T
Delivery Time 8-10week days
Product Name Rapid Thermal Annealing System
Model RTP-150RL
Maximum sample size 150mm
Process gases three sets
Software control system RL900
temperature control Tube power PID
Brand Name GaNova
Model Number JDEQ-0002
Place of Origin Suzhou China

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Quality 8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW  2.2 KW for sale

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8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW

  1. MOQ: 1

  2. Price:

  3. Get Best Quote
Delivery Time 8-10week days
Product Name DAD3350 Automatic Dicing Saw
Max. workpiece size Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application 1.8 kW, 2.2 kW
Machine dimensions(W×D×H)mm 900 × 1,050 × 1,800
Performance stable
Machine weight Approx. 1,200kg
X-axis Cutting range 260mm
X-axis Cutting speed 0.1 ~ 600mm/s
Brand Name GaNova
Place of Origin Suzhou China

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Quality 0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm for sale

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0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm

  1. MOQ: 1

  2. Price:

  3. Get Best Quote
Delivery Time 8-10week days
X-axis Cutting speed 0.1 ~ 600mm/s
Product Name DAD3350 Automatic Dicing Saw
Max. workpiece size Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application 1.8kW, 2.2kW
Machine dimensions(W×D×H)mm 900 × 1,050 × 1,800
X-axis Cutting range 260mm
Brand Name GaNova
Place of Origin Suzhou China

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Quality Automatic Wafer Dicing Machine 8 Inch 250mm × 250mm 300mm for sale

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Automatic Wafer Dicing Machine 8 Inch 250mm × 250mm 300mm

  1. MOQ: 1

  2. Price:

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Delivery Time 8-10week days
Product Name DAD3350 Automatic Dicing Saw
Max. workpiece size Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application 1.8 kW, 2.2 kW
Machine dimensions(W×D×H)mm 900 × 1,050 × 1,800
Performance stable
Machine weight Approx. 1,200kg
X-axis Cutting range 260mm
X-axis Cutting speed 0.1 ~ 600mm/s
Brand Name GaNova
Place of Origin Suzhou China

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Quality Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw for sale

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Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw

  1. MOQ: 1

  2. Price:

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Delivery Time 8-10week days
Product Name DAD3350 Automatic Dicing Saw
Max. workpiece size Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application 1.8 kW, 2.2 kW
Machine dimensions(W×D×H)mm 900 × 1,050 × 1,800
Performance stable
Machine weight Approx. 1,200kg
X-axis Cutting range 260mm
X-axis Cutting speed 0.1 ~ 600mm/s
Brand Name GaNova
Place of Origin Suzhou China

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  • Building 11, Lane 1333, Jiangnan Avenue, Changxing Town, Chongming District, Shanghai
  • https://www.epi-wafers.com/

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