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Shenzhen Shinelink Technology Ltd

  • China,Shenzhen ,Guangdong
  • Active Member

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China FR4 6 Layers Multilayer HDI Printed Circuit Boards
China FR4 6 Layers Multilayer HDI Printed Circuit Boards

  1. China FR4 6 Layers Multilayer HDI Printed Circuit Boards
  2. China FR4 6 Layers Multilayer HDI Printed Circuit Boards

FR4 6 Layers Multilayer HDI Printed Circuit Boards

  1. MOQ: Negotiable
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms L/C, T/T, Western Union, MoneyGram
Supply Ability 5000 Piece/Pieces per Day
Delivery Time 7-12 days
Packaging Details ESD Bag
Copper thickness 1oz,1/2OZ 1OZ 2OZ 3OZ
Base material FR4
Min. line spacing 4/4mil(0.1/0.1mm)
Board thickness 0.5~3.2mm
Min. line width 0.075mm/0.075mm(3mil/3mil)
Min. hole size 0.20mm,4mil
Surface finishing HASL,ENIG
Product name PCB Assembly
Application Consumer Electronics
Pcb assembly method SMT
Brand Name OEM/ODM
Model Number SL00710S15
Certification UL, Rohs
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C, T/T, Western Union, MoneyGram Supply Ability 5000 Piece/Pieces per Day
Delivery Time 7-12 days Packaging Details ESD Bag
Copper thickness 1oz,1/2OZ 1OZ 2OZ 3OZ Base material FR4
Min. line spacing 4/4mil(0.1/0.1mm) Board thickness 0.5~3.2mm
Min. line width 0.075mm/0.075mm(3mil/3mil) Min. hole size 0.20mm,4mil
Surface finishing HASL,ENIG Product name PCB Assembly
Application Consumer Electronics Pcb assembly method SMT
Brand Name OEM/ODM Model Number SL00710S15
Certification UL, Rohs Place of Origin China
High Light Multilayer HDI Printed Circuit Boards4mil HDI Printed Circuit Boards0.5mm multilayer printed circuit boards

FR4 HDI PCB 6 layers multilayer printed circuit board Electronic Pcb Board

 

 

HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried via or micro via techniques, and built-up Print Circuit Boards (PCBs) laminations. HDI PCB design is preferable for reducing the overall cost; this is done by decreasing the size and the number of layers as compared to a standard technology PCB design. It also offers better electrical performance and is one of the key technologies driving advancements in PCB electronics.

 

HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buried via or micro via techniques, high signal performance considerations, micro vias, and built-up PCB laminations. High-density Interconnection or HDI is a PCB technology that came to the limelight close to the end of the 20th century. Its popularity grew tremendously due to the numerous advantages it holds over the traditional PCBs.

 

The advanced multilayer deployed by HDI PCB manufacturing allows you to integrate multiple layers to create a multi-layered PCB.

 

 

The Six Main Types of HDI PCB Boards


1. Burial through and through channels
2. Use core-free structure with layer pairs.
3. Passive substrate, no electrical connection
4. By surface to surface offset
5. Two / more HDI layers and via vias
6. A core-free alternative structure using a pair of layers.

 

 

PCB Production Capacity

 

Layer count 1-28L,HDI
Material FR-4, High TG FR4, aluminium, FPC
Teflon,PTFE (F4B,F4BK), Rogers (4003,4350,5880)
Max board dimensions 800mm*620mm
Board shape Rectangular,round,slots,cutouts,complex,irregular
Board type Rigid,flexible,rigid-flexible
Board cutting Shear,V-score,tab-routed,counter sunk
Board thickness 0.2~8.0mm, Flex 0.1~0.25mm
Thickness Tolerance ±10%
Min line width / space 3mil/3mil
Minimum Drilling Hole (Mechanical) 0.1mm
Minimum laser hole 0.075mm
Blind Hole/buried plate YES
Hole Position/hole Tolerance PTH:±0.076MM
NPTH:±0.05mm
InnerLayer Copper Thickness 0.5-3 oz
OutLayer Copper Thickness 0.5-4 oz
Impedance control tolerance ±10%
Surface finish HASL,Lead free HASL,ENIG,Immersion Tin,Immersion Silver,OSP...
Solder mask Double-sided green,red,white,blue,black,etc
Silkscreen Double-sided or single-sided in white,black,or negative
PCB Testing E-test, Flying probe test
Acceptable File Format Gerber RS-274X,274D,AutoCAD'S DXF,DWG,Pro-E,Ki-CAD
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

 

FAQ:

 

1.What are the main factors which will affect the price of PCB?

Material;
Surface finish;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
Different manufacturing countries.

 

2. What’s the definition of PCB, PWB and FPC and what’s the difference?

PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company,Other

  • Year Established:

    2005

  • Total Annual:

    200-300

  • Employee Number:

    93~105

  • Ecer Certification:

    Active Member

The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd   We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs.   Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper... The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd   We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs.   Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper...

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Get in touch with us

  • Reach Us
  • Shenzhen Shinelink Technology Ltd
  • Chengda Business Center, Rongfu Road, Fucheng Street, Longhua District, Shenzhen
  • http://www.emspcb-assembly.com/

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