China Chips Star Semiconductor Co., Ltd.
| Delivery Time | 7~15days |
| Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s |
| Agreement | HS400 |
| Write speed | Up to 240MB/s |
| Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. |
| Brand Name | PG |
| Place of Origin | China |
View Detail Information
Explore similar products
64GB/128GB EMMC 5.1 Storage Module - Ideal For Industrial Applications
High-Performance eMMC 5.1 Embedded Flash Memory for Mobile Devices
64GB EMMC 5.1 Storage Chip - High-Speed Solution For Embedded Systems
Reliable eMMC 5.1 Flash Memory for IoT and Smart Devices Mobile Storage Solution
Product Specification
| Delivery Time | 7~15days | Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s | Agreement | HS400 |
| Write speed | Up to 240MB/s | Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND | Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. | Brand Name | PG |
| Place of Origin | China | ||
| High Light | 128gb EMMC Memory Card ，64gb EMMC Memory Card | ||
The eMMC is attached through a parallel connection directly to the main circuit board of whatever device for which it stores data. By using an integrated controller in the eMMC, the device CPU no longer has to handle placing data into storage since the controller in the eMMC takes over that function so this frees up the CPU for more important tasks. By using flash memory, the entire IC-based storage draws little power making it suitable for portable devices.
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
50~100
Ecer Certification：
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
Get in touch with us
Leave a Message, we will call you back quickly!