Delivery Time | 7~15days |
Capacity | 8GB-512GB |
Read speed | Up to 330MB/s |
Agreement | HS400 |
Write speed | Up to 240MB/s |
Operating temperature | -25℃~+85℃ |
Choice of Flash | MLC/3DTLC/QLC NAND |
Product Name | eMMC5.1 |
Usage | for automotive, industrial, and medical applications. |
Brand Name | PG |
Place of Origin | China |
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Product Specification
Delivery Time | 7~15days | Capacity | 8GB-512GB |
Read speed | Up to 330MB/s | Agreement | HS400 |
Write speed | Up to 240MB/s | Operating temperature | -25℃~+85℃ |
Choice of Flash | MLC/3DTLC/QLC NAND | Product Name | eMMC5.1 |
Usage | for automotive, industrial, and medical applications. | Brand Name | PG |
Place of Origin | China | ||
High Light | High speed EMMC Memory Card ,EMMC Memory Card 64gb ,128gb Flash Memory IC Chip |
Capacities range from 32GB to 256GB and come in different grades depending on the application (i.e. consumer & industrial) The most common eMMC capacities are 32GB and 64GB which use mainly SLC or 3D MLC NAND flash, so it is ideal for demanding applications and is highly reliable. Considering its size, eMMC is capable of handling extremely large amounts of data in such a small footprint.
Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
Capacity | 64GB | 128GB | 256GB | 512GB |
CE | 1 | 2 | 4 | 4 |
Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
50~100
Ecer Certification:
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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