China Chips Star Semiconductor Co., Ltd.
| Delivery Time | 7~15days |
| Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s |
| Agreement | HS400 |
| Write speed | Up to 240MB/s |
| Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. |
| Brand Name | PG |
| Place of Origin | China |
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Product Specification
| Delivery Time | 7~15days | Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s | Agreement | HS400 |
| Write speed | Up to 240MB/s | Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND | Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. | Brand Name | PG |
| Place of Origin | China | ||
| High Light | Emmc IC 32gb ，Nand Flash Memory Chips ，Emmc5.1 Nand Flash Memory Chips | ||
Smaller than a typical postage stamp, the tiny footprint of eMMC makes it ideal for many electronic devices, including smartphones, small laptops, smart TVs, wearable technology and smart home appliances. The “embedded” part of the name comes from the fact that the storage is usually soldered directly onto the device’s motherboard, so it is not removable nor displaced easily. eMMC storage consists of NAND flash — the same tech you’ll find in USB drives, SD cards, and solid-state drives but just packaged differently.
Beyond its use in consumer products, eMMC is rapidly being adopted in many other embedded applications, such as Single Board Computers (SBC), robotics, medical devices, automotive, networking and building control devices because of its compact size, low-power consumption and numerous enhanced features. With the rapid growth of the IoT market, eMMC is finding its way to newer applications.
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
50~100
Ecer Certification：
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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