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China Chips Star Semiconductor Co., Ltd.

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China BGA153 EMMC5.1 8GB 16GB 32GB 64GB 128GB EMMC IC Memory Chip EMMC4G
China BGA153 EMMC5.1 8GB 16GB 32GB 64GB 128GB EMMC IC Memory Chip EMMC4G

  1. China BGA153 EMMC5.1 8GB 16GB 32GB 64GB 128GB EMMC IC Memory Chip EMMC4G
  2. China BGA153 EMMC5.1 8GB 16GB 32GB 64GB 128GB EMMC IC Memory Chip EMMC4G

BGA153 EMMC5.1 8GB 16GB 32GB 64GB 128GB EMMC IC Memory Chip EMMC4G

  1. MOQ:
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms L/C, T/T
Supply Ability 100K a month
Delivery Time 10 to 15 days
Capacity 8GB-512GB
Agreement HS400
Read speed Up to 330MB/s
Write speed Up to 240MB/s
Operating temperature -25℃~+85℃
Choice of Flash MLC/3DTLC/QLC NAND
Brand Name PG
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C, T/T Supply Ability 100K a month
Delivery Time 10 to 15 days Capacity 8GB-512GB
Agreement HS400 Read speed Up to 330MB/s
Write speed Up to 240MB/s Operating temperature -25℃~+85℃
Choice of Flash MLC/3DTLC/QLC NAND Brand Name PG
Place of Origin China
High Light BGA153 EMMC5.1EMMC5.1 8GBEMMC IC Memory Chip
EMMC5.1 Memory Chip 8GB 16GB 32GB 64GB 128GB Emmc Ic BGA153 EMMC4G Flash Memory Ic Chip High Quality
 
 
The Gemini series eMMC5.1 is based on high-performance controller LDPC technology , Samsung and KIOXIA BiCS5 3DTLC/YMTC QLC NAND Flash for multi-layer stacking, complying with the HS400 standard. It meets customers' demanding requirements for large capacity, high performance, low power consumption, compatibility, and stability of eMMC in complex and diverse applications.
 
CA EMMC5.1 Specification
Model G2564GTLCA G25128TLCA G25256TLCA G25512TLCA
NAND flash 3DTLC NAND 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB 512GB
CE 1 2 4 4
Read speed up to 330MB/s up to 330MB/s up to 330MB/s up to 330MB/s
Write speed up to 240MB/s up to 240MB/s up to 240MB/s up to 240MB/s
Operating temperature
-25℃~85℃
-25℃~85℃
-25℃~85℃
-25℃~85℃
EP ≥3000 ≥3000 ≥3000 ≥3000
Packaging specification BGA 153 BGA 153 BGA 153 BGA 153
Size 11.5mmx13mmx1.0mm 11.5mmx13mmx1.0mm 11.5mmx13mmx1.2mm 11.5mmx13mmx1.2mm

 

Technical details of eMMC chip
Pin definition

  • The pin definition of the eMMC chip is slightly different from that of a general SIM card or SD card, and needs to be modified appropriately according to the specific hardware device and chip specifications.

 

PCB design considerations

  • Power supply and interface: Ensure a stable power supply and ground cable for the eMMC chip.
  • Layout and routing: The length of the signal line should be matched as far as possible to reduce the delay and distortion of signal transmission.

 

Advantages of eMMC chips
Suitability for mobile devices

  • Because of its compact design and high performance, eMMC chips have become the most popular storage units in mobile devices.

 

Data security and reliability

  • By integrating controllers and using advanced communication protocols, eMMC chips provide data security and reliability.

 

 

In short, eMMC chips play a crucial role in modern mobile devices due to their high efficiency, reliability and easy integration.

 

WHY CHOOSE US?
1.Strong research and development strength
2. Our factory has advanced packaging and testing technology
3. Complete storage product production line
4. Operating our own brand PG focuses on the storage semiconductor field
5. Possess multiple copyright patents
6. High cost-effectiveness, and competitiveness

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    50~100

  • Ecer Certification:

    Verified Supplier

China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...

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Get in touch with us

  • Reach Us
  • China Chips Star Semiconductor Co., Ltd.
  • Room 401-404, Unit 1, Building B, Building 8, Huaqiang Creative Industrial Park, Biyan Community, Guangming Street, Guangming Dist.
  • https://www.emmcmemorycard.com/

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