Shenzhen Zhengte Electronics.,Co Ltd
| Base Material | FR-4,CEM-3, Roger, TEFLON, TAC... |
| Standard | IPC-A-600H Class 2, Class 3, TS1.... |
| Finish | HAS/ lead Free/Gold/OSP/... |
| HS Code | 8534009000 |
| Place of Origin | CHINA |
| Brand Name | OEM,ODM |
| Model Number | zt-pcb-0105 |
| Certification | UL,ISO9001:2008 |
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Product Specification
| Base Material | FR-4,CEM-3, Roger, TEFLON, TAC... | Standard | IPC-A-600H Class 2, Class 3, TS1.... |
| Finish | HAS/ lead Free/Gold/OSP/... | HS Code | 8534009000 |
| Place of Origin | CHINA | Brand Name | OEM,ODM |
| Model Number | zt-pcb-0105 | Certification | UL,ISO9001:2008 |
| High Light | multilayer PCB ，PCB manufacturer ，PCB manufacturer | ||
Zhengte Electronics PCB&PCBA Contract Manufacturing Services Including Belows:
Best PCB manufacturer,FR-4 material multilayer PCB
1.Fast PCB Fabrication for Samples and Mass Production
2.Electronic Components Sourcing Servics
3.PCBA Assembly Services:SMT,DIP,BGA...
4.Function Test
5.Stencil and Enclosure Assembly
6.Standard Packing and On time Delivery
Main Products Application
1.Household Appliances
2.Medical Products
3.Automotive Products
4.Industrial Products
5.Communication Products(AVL/GPS/GSM Devices)
6.Consumer Electronics
PCB Fabrication Capabilities
| Number of Layer | 1,2,4 or 6,upto 18 layer |
| Order Quantity | 1 to 50,000 |
| Board Shape | Retangular,round,slots,cutouts,complex,irregular |
| Board Type | Rigid, Flexible, Rigid-flexible |
| Board Material | FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc. |
| Board Cutting | Shear,V-score,Tab-routed |
| Board Thickness | 0.2-4.0mm, Flex 0.01-0.25mm |
| Copper Weight | 1.0, 1.5, 2.0 oz |
| Solder Mask | Double-sided green LPI,Also support Red,White,Yellow,Blue,Black |
| Silk Screen | Double-sided or single-sided in white,yellow,black,or negative |
| Silk Screen Min Line Width | 0.006'' or 0.15mm |
| Max Board Dimensions | 20 inch*20inch or 500mm*500mm |
| Min Trace/Gap | 0.10mm, or 4mils |
| Min Drill Hole Diameter | 0.01'',0.25mm, or 10mils |
| Surface Finish | HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc. |
| Board Thickness Tolerance | ±10% |
| Copper Weight Tolerance | ± 0.25 oz |
| Minimal Slot Width | 0.12'', 3.0mm, or 120mils |
| V-Score Depth | 20-25% of board thickness |
| Design File Formate | Gerber RS-274,274D,Eagle and AutoCAD's DXF,DWG,PCB file |
PCB Assembly Capabilities
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
| Type of Assembly | SMT,Thru-hole |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
| Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
| File Formate | Bill of Materials Gerber files Pick-N-Place file |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
| PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
PCB Lead Time
| Layer/Days | Sample(Normal) | Sample(Fast) | Mass Production |
| Single/Double | 3-5days | 24-72hours | 7-10days |
| Four Layer | 5-7days | 5days | 7-12days |
| Six Layer | 10-12days | 8days | 13-15days |
| Eight Layer | 15-20days | 7-10days | 16-20days |
Detailed Terms for PCB Assembly
1.Technical requirement for pcb assembly: What we can do?
1) Professional Surface-mounting and Through-hole soldering Technology
2)Various sizes like1206,0805,0603,0402,0201 components SMTTech
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity
2.Production Details:
1) Material Management
Supplier → Components Purchase → IQC → Protection Control →Material Supply → Firmware
2) Program Management
PCB Files → DCC → Program Organizing → Optimization → Checking
3) SMT Management
PCB Loader → Screen Printer → Checking → SMD Placement →Checking → Air Reflow → Vision Inspection → AOI → Keeping
4) PCBA Management
THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT →
Flash → FCT → Checking → Package → Shipment
3.Our Advantage:
1.Related Certificate --- UL ,ISO9001:2000 , TS16949, Rosh.
2.100% electrical test, AOI testing, four times 100% QC inspection beofre shipping.
3.High reliable, Germany equipment ,competitive price andSpeedy delivery.
4.Fast Prototype Service.
5.One stop electronic assembly service(provide prototype, plastic injection molding, part painting,
components purchasing, SMT COB,DIP,PCBA service as one unit).
4.Package:
RFQs
1.How can I get quotation in time?
5.What files in need for the PCB Assembly services?
Besides the PCB files and Components list,we also need PNP(Pick and Place)
and Components Position files for production.
CONTACT USSHENZHEN ZHENGTE ELECTRONICS CO., LTD.Company Details
Business Type:
Manufacturer
Year Established:
2007
Employee Number:
200-500
Ecer Certification：
Active Member
Professional PCB manufacturer in China Zhengte Electronics Professionally Provides the following manufactures and service, 1, PCB,FPC 2, Electronic Assembly, Surface Mounting 3, Selection/Purchase of Components and Parts 4, PCB Layout ... Professional PCB manufacturer in China Zhengte Electronics Professionally Provides the following manufactures and service, 1, PCB,FPC 2, Electronic Assembly, Surface Mounting 3, Selection/Purchase of Components and Parts 4, PCB Layout ...
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