Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
| Payment Terms | T/C,T/T |
| Supply Ability | 300/pcs per month |
| Delivery Time | 2-3weeks |
| Packaging Details | Carton Box |
| Name | Silicon wafer back Grinding Wheels |
| Applications | Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer |
| Space code | 6A2 or 6A2H;6A2T |
| Size | Customer requirements |
| Using | Semiconductor silicon |
| Body | LED substrate |
| Brand Name | HT |
| Model Number | HT-BGW |
| Certification | ISO9001:2015 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/C,T/T | Supply Ability | 300/pcs per month |
| Delivery Time | 2-3weeks | Packaging Details | Carton Box |
| Name | Silicon wafer back Grinding Wheels | Applications | Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer |
| Space code | 6A2 or 6A2H;6A2T | Size | Customer requirements |
| Using | Semiconductor silicon | Body | LED substrate |
| Brand Name | HT | Model Number | HT-BGW |
| Certification | ISO9001:2015 | Place of Origin | China |
| High Light | industrial grinding wheels ，glass grinding wheel | ||
6A2 Back Grinding Wheel High Efficiency Custom Size Sapphire Epitaxial Wafer
Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.
1. Silicon Wafer Back Grinding Wheel
This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.
Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers
Work Piece Materials: Monocrystalline silicon and other semiconductor materials
Processes: Back to front rough and fine grinding
2. LED Substrate Back Grinding Wheels
This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.
Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers
Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
5000000-10000000
Employee Number:
400~500
Ecer Certification：
Active Member
Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a... Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a...
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