Payment Terms | T/C,T/T |
Supply Ability | 300/pcs per month |
Delivery Time | 2-3weeks |
Packaging Details | Carton Box |
Type | Machine Blade |
Blade Material | Diamond |
Size | 58 |
Application | Semicoductor,Ceramic chips |
Thickness | 0.25MM |
Bond | Resin |
Brand Name | Hongtuo |
Model Number | HT-RB |
Certification | ISO9001:2015&ISO16949 |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/C,T/T | Supply Ability | 300/pcs per month |
Delivery Time | 2-3weeks | Packaging Details | Carton Box |
Type | Machine Blade | Blade Material | Diamond |
Size | 58 | Application | Semicoductor,Ceramic chips |
Thickness | 0.25MM | Bond | Resin |
Brand Name | Hongtuo | Model Number | HT-RB |
Certification | ISO9001:2015&ISO16949 | Place of Origin | China |
High Light | precision diamond saw ,disco wafer dicing |
Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips
Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.
Features:
1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.
2. Resin bonds are extremely flexible, therefore improving the surface finish quality.
Applications:
This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.
Specifications
Technical Parameters
O.D | Thickness | I.D | ||||
Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
50~ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 |
+0.02~ 0 |
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1997
Total Annual:
5000000-10000000
Employee Number:
400~500
Ecer Certification:
Active Member
Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a... Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a...
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