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Xinzheng Dia Abrasives Co.,Ltd

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China Semiconductor Photoelectricity 175cm Metal Bond Grinding Wheel
China Semiconductor Photoelectricity 175cm Metal Bond Grinding Wheel

  1. China Semiconductor Photoelectricity 175cm Metal Bond Grinding Wheel

Semiconductor Photoelectricity 175cm Metal Bond Grinding Wheel

  1. MOQ: 1PC
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Common Shape 6A2, 6A2T
Wheel Size OD: 175,195,209,305,255,355
Application Semiconductor industry
Bond Metal
Key word Metal Bond Back Thinning Wheels
Grit size "Coarse Grit: 270--800 Finish Grit: 2000--8000"
Place of Origin China
Certification High QC standard, 100% inspection

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time Packaging Details Box
Common Shape 6A2, 6A2T Wheel Size OD: 175,195,209,305,255,355
Application Semiconductor industry Bond Metal
Key word Metal Bond Back Thinning Wheels Grit size "Coarse Grit: 270--800 Finish Grit: 2000--8000"
Place of Origin China Certification High QC standard, 100% inspection
High Light Photoelectricity Metal Bond Grinding Wheel175cm diamond bruting wheel175cm Metal Bond Grinding Wheel
Metal Bond Grinding Wheel For Semiconductor And Photoelectricity

 

The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

 

 

Features:

 

  1. ​Good surface quality
  2. High efficiency
  3. No scratch
  4. No chipping
  5. Long using life

 

Specification:

 

 

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
6A2, 6A2T, 1A1 OD: 175,195,209,305,255,355 Coarse Grit: 270--800
Finish Grit: 2000--8000
6A2 175D 30T 76H
6A2 200D 35T 76H
6A2T 280D 30T 228.6H
1A1 40D 5T 18.7H
Semiconductor industry Sapphire, silicon wafer SHUWA, NTS, WEC, GALAXY. SPEEDFAM
DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
Vitrified
Metal
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Ecer Certification:

    Active Member

Xinzheng Dia Abrasives Co., Ltd is a professional manufacturer of diamond and CBN grinding wheels with an capacity of 20,000pcs/month. Its products cover resin, vitrified, metal, electroplated and hybrid bonded diamond and CBN tools, which have been widely used in the fields of Automobiles, Bearing,... Xinzheng Dia Abrasives Co., Ltd is a professional manufacturer of diamond and CBN grinding wheels with an capacity of 20,000pcs/month. Its products cover resin, vitrified, metal, electroplated and hybrid bonded diamond and CBN tools, which have been widely used in the fields of Automobiles, Bearing,...

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Get in touch with us

  • Reach Us
  • Xinzheng Dia Abrasives Co.,Ltd
  • 28-4#, China Germany Park, Xuedian Town, Xinzheng City
  • https://www.diamond-grindingwheel.com/

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