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Xinzheng Dia Abrasives Co.,Ltd

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Grinding Wheel For Semiconductor And Photoelectricity

Manufacturer of a wide range of products which include Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries,Good Self Sharpening Grinding Wheel For Cutting Tools Industry With High,Free Cutting Resin Bond Ce...

Quality Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries for sale

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Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries

  1. MOQ: 1PC

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 10-14 days delivery time
Packaging Details Box
Bonding Agent Resin
Common Shape 1A1
Type: Cutting Tool
Feature High efficiency
Key word Centerless Wheels
Grit size Resin bond the finest grit size is 3000
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Good Self Sharpening Grinding Wheel For Cutting Tools Industry With High for sale

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Good Self Sharpening Grinding Wheel For Cutting Tools Industry With High

  1. MOQ: 1PC

  2. Price: Negotiable

  3. Get Best Quote
Packaging Details Box
Delivery Time 10-14 days delivery time
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Keyword: Resin Bond Centerless grinding Wheels
Application CNC Grinder
Grit D46-D107
Bond Resin
Features: High cutting effeciency
Shape: 1A1/6A1/9A1
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Free Cutting Resin Bond Centerless Wheels For Carbide Rods And Bushings for sale

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Free Cutting Resin Bond Centerless Wheels For Carbide Rods And Bushings

  1. MOQ: 1PC

  2. Price: Negotiable

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Packaging Details Box
Delivery Time 10-14 days delivery time
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Keyword: Resin Bond Cut Off Wheels
Application CNC Grinder
Grit D46-D107
Bond Resin
Features: High cutting effeciency
Shape: 1A1/6A1/9A1
Place of Origin China
Certification High QC standard, 100% inspection
Model Number 1A1, 9A1

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Quality Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity for sale

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Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity

  1. MOQ: 1PC

  2. Price: Negotiable

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Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 10-14 days delivery time
Packaging Details Box
Common Shape 1A1R
Bond Resin Metal
Application Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic
Feature High Precision
Key word Gang Cutting Blades
Grit size #80-#3000
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Small Centerless Grinder Wheels 1A1 Common Shape With High Durability for sale

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Small Centerless Grinder Wheels 1A1 Common Shape With High Durability

  1. MOQ: 1PC

  2. Price: Negotiable

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Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 10-14 days delivery time
Packaging Details Box
Assurance: quality warranty
Application Semiconductor and Photovoltaic industries
Feature High efficiency
Product Keywords Centerless Grinder Wheels
Wheel Size Resin Maximum OD is 750mm Vitrified OD:300mm~500mm
Grit size Resin bond the finest grit size is 3000
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity for sale

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Vitrified & Metal Bond Grinding Wheel For Semiconductor And Photoelectricity

  1. MOQ: 1PC

  2. Price: Negotiable

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Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Common Shape 6A2, 6A2T
Wheel Size OD: 175,195,209,305,255,355
Application Semiconductor industry
Bond Vitrified, Metal
Key word Vitrified & Metal Bond Back Thinning Wheels
Grit size "Coarse Grit: 270--800 Finish Grit: 2000--8000"
Place of Origin China
Certification High QC standard, 100% inspection

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Quality High Performance Grinding Wheel For Semiconductor And Photoelectricity for sale

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High Performance Grinding Wheel For Semiconductor And Photoelectricity

  1. MOQ: 1PC

  2. Price: Negotiable

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Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Bond Resin
Wheel Size OD: 175,195,209,305,255,355
Application Semiconductor industry
Key word Resin Bond Back Thinning Wheels
Grit size "Coarse Grit: 270--800 Finish Grit: 2000--8000"
Common Shape 6A2, 6A2T
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Long Using Life Back Thinning Grinding Wheels 6A2/6A2T Common Shape for sale

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Long Using Life Back Thinning Grinding Wheels 6A2/6A2T Common Shape

  1. MOQ: 1PC

  2. Price: Negotiable

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Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Feature Good surface quality
Wheel Size OD: 175,195,209,305,255,355
Application Semiconductor industry
Bond Resin
Key word Resin Bond Back Thinning Wheels
Grit size Coarse Grit: 270--800 Finish Grit: 2000--8000
Place of Origin China
Certification High QC standard, 100% inspection

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Quality Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping for sale

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Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

  1. MOQ: 1PC

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Common Shape 6A2, 6A2T
Bond Vitrified
Application Semiconductor industry
Key word Back Thinning Wheels​
Grit size Coarse Grit: 270--800 Finish Grit: 2000--8000
Feature High efficiency
Place of Origin China
Certification High QC standard, 100% inspection

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Quality High Efficiency Grinding Wheel For Semiconductor And Photoelectricity Industry for sale

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High Efficiency Grinding Wheel For Semiconductor And Photoelectricity Industry

  1. MOQ: 1PC

  2. Price: Negotiable

  3. Get Best Quote
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Common Shape 6A2, 6A2T
Feature No chipping
Wheel Size OD: 175,195,209,305,255,355
Bond Vitrified
Application Semiconductor And Photoelectricity industry
Key word Vitrified Bond Back Thinning Wheels
Place of Origin China
Certification High QC standard, 100% inspection

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  • Xinzheng Dia Abrasives Co.,Ltd
  • 28-4#, China Germany Park, Xuedian Town, Xinzheng City
  • https://www.diamond-grindingwheel.com/

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