View Detail Information
Explore similar products
RO3203 PCB 2-Layer 60mil | Immersion Gold | ceramic-filled laminates reinforced
RT/duroid 6035HTC Double Sided high frequency rigid PCB with 1oz Copper and
Double Sided Rigid-flex PCBs Built on RO4003C With Hot Air Soldering Green
TLX-0 2-layer rigid PCB Built On PTFE fiberglass composites with Immersion Gold
Product Specification
TSM-DS3 High Frequency PCB: Redefining High-Power Applications
TSM-DS3 High Frequency PCB is a cutting-edge solution that is revolutionizing the realm of high-power applications. This ceramic-filled reinforced material boasts exceptional properties that make it a viable alternative to traditional epoxies for fabricating complex multilayer PCBs. With a low fiberglass content of approximately 5%, TSM-DS3 offers thermal stability, industry-leading low loss core, and predictability comparable to the best fiberglass reinforced epoxies.
Featuring a dielectric constant of 3.0 with tight tolerance at 10 GHz/23°C and a dissipation factor of 0.0014 at 10GHz, TSM-DS3 ensures precise electrical performance with minimal signal loss. Its high thermal conductivity of 0.65 W/MK effectively dissipates heat, making it ideal for applications where heat management is crucial. Additionally, TSM-DS3 exhibits dimensional stability that rivals epoxy materials and is compatible with resistive foils.
One of the key benefits of TSM-DS3 is its ability to enable the fabrication of large format, high layer count PCBs with consistency and predictability. Designed for high-power applications, TSM-DS3 offers thermal stability and low coefficients of thermal expansion, ensuring reliability in demanding thermal cycling environments. With a focus on high yield production and quality, TSM-DS3 paves the way for advanced PCB designs that meet the most stringent requirements.
From couplers and phased array antennas to radar manifolds and semiconductor/ATE testing, TSM-DS3 finds applications across diverse industries. Its exceptional properties, advanced manufacturing capabilities, and compatibility with complex designs position TSM-DS3 as a game-changer in the world of high-frequency circuit materials. Experience the power and versatility of TSM-DS3 High Frequency PCB and elevate your high-power applications to new heights.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!