Shenzhen Bicheng Electronics Technology Co., Ltd
View Detail Information
Explore similar products
F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin
F4BTM350 High Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion
F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion
Product Specification
F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
The PCB we discussed today has a size of 89mm x 61mm, with just 1 piece in a panel. It's a double sided PCB, meaning it has two conductive layers for circuitry. There are no surface mount components on this PCB. Instead, it has through hole components. The layer stackup consists of copper layers with a finished thickness of 35um (equivalent to 1oz). In between, there is F4BME265 material with a thickness of 1.5mm, and then another copper layer of the same 35um (1oz) thickness on the other side after its plating.
Here’s more details in the table.
PCB Specifications
| PCB SIZE | 89 x 61mm=1PCS |
| BOARD TYPE | Microwave PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | NO |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+PLATE |
| F4BME265 1.524mm | |
| copper ------- 18um(0.5oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6mil/9mil |
| Minimum / Maximum Holes: | 0.9/2.3mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 156 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BME265 dk2.65 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | OSP, Thickness >0.2µm |
| Solder Mask Apply To: | TOP, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | No silkscreen required. |
| Colour of Component Legend | No silkscreen required. |
| Manufacturer Name or Logo: | No silkscreen required. |
| VIA | Plated through hole(PTH), via open. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
F4BME High Frequency Laminates
F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
Product Features
◆ DK2.17 ～ 3.0 is optional, and DK can be customized
◆ Low loss
◆ F4BME with RTF copper foil has excellent PIM index
◆ Diversified size and cost saving
◆ Irradiation resistance and low exhaust
◆ Commercialization, mass production and high cost performance
Typical Applications
◆ Microwave, RF, radar
◆ Phase shifter, passive components
◆ Power divider, coupler and combiner
◆ Feed network, phased array antenna
◆ Satellite communication, base station antenna
Data Sheet (F4BME)
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. | |||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!