Payment Terms | T/T, Paypal |
Supply Ability | 45000 pieces per month |
Delivery Time | 10 working days |
Packaging Details | Vacuum |
Number of Layers | 2 |
Glass Epoxy | RT/duroid 6010 |
Final height of PCB | 1.3mm ±0.13 |
Final foil external | 1.5 oz |
Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel |
Solder Mask Color | none |
Colour of Component Legend | Black |
Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Technologies Limited |
Model Number | BIC-0061-V2.0 |
Certification | UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
Delivery Time | 10 working days | Packaging Details | Vacuum |
Number of Layers | 2 | Glass Epoxy | RT/duroid 6010 |
Final height of PCB | 1.3mm ±0.13 | Final foil external | 1.5 oz |
Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel | Solder Mask Color | none |
Colour of Component Legend | Black | Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Technologies Limited | Model Number | BIC-0061-V2.0 |
Certification | UL | Place of Origin | China |
Rogers High Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for Satellite Communications Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.
PCB Capability (RT/duroid 6010)
PCB Material: | Ceramic-PTFE composite |
Designator: | RT/duroid 6010LM |
Dielectric constant: | 10.2 ±0.25 (process) |
10.7 (design) | |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 25mil (0.635mm) |
50mil (1.27mm), 75mil (1.90mm) | |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
Features and Benefits |
1. High dielectric constant for circuit size reduction |
2. Low loss. Ideal for operating at X-bank or below |
3. Low moisture absorption reducing effects of moisture on electrical loss |
4. Low Z-axis expansion providing reliable PTH in multilayer boards |
4. Tight DK and thickness control for repeatable circuit performance |
The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.
Appendix1: Properties of RT/duroid 6010LM laminates.
RT/duroid 6010 Typical Value | |||||
Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
Ultimate Strain | 25 | Z | % | ||
Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion | 24 24 47 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D3850 | ||
Density | 3.1 | g/cm3 | ASTM D792 | ||
Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) | Calculated | ||
Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Appendix2: Automatic silkscreen machine
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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