Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Glass Epoxy: | RF-35TC |
| Final foil | 1.0 Oz |
| Final height of PCB: | 0.6 mm ±10% |
| Surface Finish | ENIG |
| Solder Mask Color: | Black |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0025-V0.63 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Glass Epoxy: | RF-35TC |
| Final foil | 1.0 Oz | Final height of PCB: | 0.6 mm ±10% |
| Surface Finish | ENIG | Solder Mask Color: | Black |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-0025-V0.63 |
| Certification | UL | Place of Origin | China |
Taconic PCB Built on RF-35TC 20mil 0.508mm with Black Solder Mask and Immersion Gold for Power Amplifiers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.
RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.
This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.
The RF-35TC laminates are ideal for antennas, satellites, filters, couplers and power amplifiers.
PCB Specifications
| PCB SIZE | 95 x 68mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
| RF-35TC 0.508mm | |
| copper ------- 35um(1oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.4 mm / 5.5 mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 12 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RF-35TC 0.508mm |
| Final foil external: | 1.5 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.6 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | ENIG |
| Solder Mask Apply To: | TOP, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of RF-35TC
| RF-35TC TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
| Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
| Df at 10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
| Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
| Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
| Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
| Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
| Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
| Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
| Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
| Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
| Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
| Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
| Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
| Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
| Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
| Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
| Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
| Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
| Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
| Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
| Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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