Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 10 |
| Glass Epoxy: | RO4350B, RO4450B mixed with FR-4 TG>135 |
| Final foil | 1.5 Oz |
| Final height of PCB: | 1.7 mm ±10% |
| Surface Finish | Immersion Gold (17.7%) 2µ" over 100µ" nickel |
| Solder Mask Color: | Red |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise |
| Model Number | BIC-005-V0.05 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 10 | Glass Epoxy: | RO4350B, RO4450B mixed with FR-4 TG>135 |
| Final foil | 1.5 Oz | Final height of PCB: | 1.7 mm ±10% |
| Surface Finish | Immersion Gold (17.7%) 2µ" over 100µ" nickel | Solder Mask Color: | Red |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise | Model Number | BIC-005-V0.05 |
| Certification | UL | Place of Origin | China |
| PCB SIZE | 210 x 85mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 10 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| RO4350B core 0.168mm | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| RO4450B Prepreg (2x0.1) 0.2mm | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| RO4350B core 0.168mm | |
| copper ------- 18um(0.5oz) MidLayer 3 | |
| RO4450B Prepreg (2x0.1) 0.2mm | |
| copper ------- 18um(0.5oz) MidLayer 4 | |
| RO4350B core 0.168mm | |
| copper ------- 18um(0.5oz) MidLayer 5 | |
| RO4450B Prepreg (2x0.1) 0.2mm | |
| copper ------- 18um(0.5oz) MidLayer 6 | |
| RO4350B core 0.168mm | |
| copper ------- 18um(0.5oz) MidLayer 7 | |
| FR-4 pregpreg 0.1mm | |
| copper ------- 18um(1oz) MidLayer 8 | |
| FR-4 core 0.1mm | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.9mil/5.9mil |
| Minimum / Maximum Holes: | 0.3mm/3.8mm |
| Number of Different Holes: | 16 |
| Number of Drill Holes: | 11385 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B, RO4450B mixed with FR-4 TG>135 |
| Final foil external: | 1.5oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.7mm ±0.17 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (17.7%) 2µ" over 100µ" nickel |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Red |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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