Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | TMM13i |
| Final height of PCB | 1.6 mm ±0.16mm |
| Final foil external: | 1 oz |
| Surface Finish | Immersion gold |
| Solder Mask Color: | Green |
| Colour of Component Legend | White |
| TEST | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-159-V5.7 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Glass Epoxy | TMM13i | Final height of PCB | 1.6 mm ±0.16mm |
| Final foil external: | 1 oz | Surface Finish | Immersion gold |
| Solder Mask Color: | Green | Colour of Component Legend | White |
| TEST | 100% Electrical Test prior shipment | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-159-V5.7 | Certification | UL |
| Place of Origin | China |
Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High DK 12.85 RF PCB With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Rogers' TMM13i thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 12.85 and dissipation factor of 0.0019.
TMM13i has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM13i is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.
Since TMM13i is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our PCB Capability(TMM13i)
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM13i |
| Dielectric constant: | 12.85 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc.. |
Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Value of TMM13i
| Property | TMM13i | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 12.85±0.35 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 12.2 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0019 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -70 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | - | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | - | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 213 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | - | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 4.0 (0.7) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | - | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.13 | |||||
| Specific Gravity | 3 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | - | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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