Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T , Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 2-3 working days |
| Packaging Details | KK carton (hard card) |
| Base material | Stainless steel shim |
| Structure | Stencil foils with aluminum frame |
| Foil Thickness | 0.12mm |
| Aperture configured | Laser cut |
| Appearance | Engraving and electro polishing |
| Fiducial mark | Through hole |
| Application | CSP, BGA, 0.5mm QFP etc. package |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0818-V8.18 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T , Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 2-3 working days | Packaging Details | KK carton (hard card) |
| Base material | Stainless steel shim | Structure | Stencil foils with aluminum frame |
| Foil Thickness | 0.12mm | Aperture configured | Laser cut |
| Appearance | Engraving and electro polishing | Fiducial mark | Through hole |
| Application | CSP, BGA, 0.5mm QFP etc. package | Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0818-V8.18 | Certification | UL |
| Place of Origin | China |
A new two-layer rigid printed circuit board (PCB) designed for operation in demanding temperature environments has recently been shipped by Bicheng Electronics. The 43mm x 86mm board was constructed using hydrocarbon ceramic woven glass laminate material RO4360G2, which allows operation from -40°C to +85°C, making it suitable for automotive, aerospace, and industrial applications.
The PCB stackup consists of two 1oz copper layers, between which 20 mil of RO4360G2 dielectric material was used, resulting in a finished board thickness of 0.6mm. The lead-free fabrication process was executed to meet IPC Class 2 requirements with minimum 7/9 mil trace/space, 0.3mm minimum hole size, and 1 mil via plating.
There are a total of 35 components on the PCB, with 90 pads, including 26 thru-hole and 64 surface mount pads on the top layer. No components were placed on the bottom layer. The board routing contains 12 nets connecting the 46 vias between layers. Electrical testing was done to ensure 100% properly functioning boards prior to shipping.
The PCB layers were laid out using Gerber RS-274X format artwork for precise reproduction during fabrication. Reflow soldering will allow efficient component attachment. Selective gold plating may be applied to contact fingers or areas needing solderability protection.
Several features make the board well-suited for rugged applications. The RO4360G2 base material provides a Tg of >280°C for resisting high temperatures. The 1oz copper provides excellent thermal performance to dissipate heat. The woven glass reinforcement increases strength and ruggedness. Immersion silver finish was used to allow extended shelf life and excellent solderability.
Bicheng Electronics maintains capabilities for quick-turn prototyping in addition to medium and high volume PCB production. Their comprehensive quality system and rigorous testing ensures consistent products that meet requirements. Customers receive regular communication and support throughout the fabrication process. Any technical questions should be directed to Sally Mao at sales30@bichengpcb.com.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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