Payment Terms | T/T, Western Union |
Supply Ability | 45000 pieces per month |
Delivery Time | 5-6 working days |
Packaging Details | Vacuum |
Number of Layers | 2 |
Glass Epoxy | Polyimide (PI) 25um |
Final foil | 2 Oz |
Final height of PCB | 0.15 mm ±10% |
Surface Finish | Immersion Gold |
Solder Mask Color | Yellow |
Colour of Component Legend | White |
Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise |
Model Number | BIC-0257-V2.57 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
Delivery Time | 5-6 working days | Packaging Details | Vacuum |
Number of Layers | 2 | Glass Epoxy | Polyimide (PI) 25um |
Final foil | 2 Oz | Final height of PCB | 0.15 mm ±10% |
Surface Finish | Immersion Gold | Solder Mask Color | Yellow |
Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise | Model Number | BIC-0257-V2.57 |
Certification | UL | Place of Origin | China |
Take High-Frequency Designs to New Heights with RO3203 Circuit Materials
When every cubic millimeter counts but signals need to soar above 20 GHz, turn to Rogers' RO3203 circuit materials. This woven glass-reinforced laminate optimizes both density and microwave performance to unleash your design's full potential.
RO3203 boasts a tightly controlled dielectric constant of 3.02 ±0.04 from plate to plate. This consistent value allows precise, repeatable circuit miniaturization. Even better, its ultra-low dissipation factor of just 0.0016 maintains signal clarity and integrity at the highest frequencies.
Woven E-glass reinforcement imbues boards with exceptional rigidity for complex, high-layer-count multilayer designs. RO3203 remains dimensionally stable regardless of environmental fluctuations from -55°C to 288°C. Its thermal expansion properties precisely match copper to prevent delamination or fatigue cracking.
For a recent automotive collision avoidance system, our engineers utilized RO3203 to maximize layers and routing density. A multi-chip module populated a compact 65x42mm, 2-layer board with 19 components and 52 total pads. Smallest linespace was a tight 5/6 mils.
Extensive RF and thermal cycle testing proved the design's longevity. The client anticipated RO3203 would withstand decades of heat, shock and vibration in under-hood mounting.
Competitively priced for high-volume use, RO3203 underpins mission-critical applications in automotive, wireless infrastructure, remote monitoring and more. Its 10,000 sqft size enables smooth-flowing, waste-reducing production runs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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