Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T,Paypal |
| Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY |
| Packaging Details | VACUUM |
| Board Material | PET 25µm |
| Board Thickness | 0.20 mm |
| Surface/Inner layer Cu thickness | 35 µm |
| Surface Finish | Immersion Gold |
| Coverlay Colour | Black |
| Color of Silkscreen | White |
| Function | 100% Pass electrical test |
| Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0295-V2.95 |
| Certification | UL |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T,Paypal | Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY | Packaging Details | VACUUM |
| Board Material | PET 25µm | Board Thickness | 0.20 mm |
| Surface/Inner layer Cu thickness | 35 µm | Surface Finish | Immersion Gold |
| Coverlay Colour | Black | Color of Silkscreen | White |
| Function | 100% Pass electrical test | Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0295-V2.95 |
| Certification | UL | Place of Origin | CHINA |
Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.
The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.
Features:
1.Dielectric constant of 2.55+/- 0.05
2. Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C
3. Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C
4. Dissipation factors ranging from .0022 to .0026
5. High glass transition temperature (Tg) exceeding 280°C
Benefits:
Our PCB Capability( RO4725JXR)
| PCB Capability (TMM10) | |
| PCB material: | Hydrocarbon / Ceramic / Woven Glass |
| Designation: | RO4725JXR |
| Dielectric constant: | 2.55 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 30.7mil(0.780mm), 60.7mil (1.542mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow, White etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |
Typical Applications
Cellular Base Station Antennas
RO4725JXR Typical Properties
| Property | RO4725JXR | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr Design | 2.64 | Z | 1.7 GHz - 5 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| 0.0022 | 2.5GHz | ||||
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
| PIM | -166 | dBc | 50 ohm 0.060” | 43dBm 1900MHz | |
| Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
| Flexural Strength MD | 121 (17.5) | MPa (kpsi) | RT | ASTM D790 | |
| CMD | 92 (13.3) | ||||
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch +E2/150°C | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y | ||||
| 25.6 | Z | ||||
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
| Td | 439 | °C | ASTM D3850 | ||
| Density | 1.27 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL94 | |||
| Lead-Free Process Compatible | YES |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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