Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Glass Epoxy | RO4350B 20.7mil (0.526mm), Tg 288℃ |
| Final foil | 1.0 Oz |
| Final height of PCB | 0.6 mm ±10% |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-135-V0.22 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Glass Epoxy | RO4350B 20.7mil (0.526mm), Tg 288℃ |
| Final foil | 1.0 Oz | Final height of PCB | 0.6 mm ±10% |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) | Solder Mask Color | Green |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-135-V0.22 |
| Certification | UL | Place of Origin | China |
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.
Features and Benefits:
RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
Our PCB Capability (RO4350B LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4350B LoPro |
| Dielectric constant: | 3.48±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
4. RF Identification Tags
Typical Properties of RO4350B LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.48 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.55 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0037 0.0031 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 50 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 11473(1664) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 175(25.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 255(37) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 14 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 16 | y | ||||
| 35 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.62 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.86 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 0.88(5.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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