Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Glass Epoxy | TMM10 |
| Final foil | 1.0 Oz |
| Final height of PCB | 1.4 mm ±10% |
| Surface Finish | Immersion gold, |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-151-V0.37 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Glass Epoxy | TMM10 |
| Final foil | 1.0 Oz | Final height of PCB | 1.4 mm ±10% |
| Surface Finish | Immersion gold, | Solder Mask Color | Green |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-151-V0.37 |
| Certification | UL | Place of Origin | China |
Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.
The electrical and mechanical properties of TMM10 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.
TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.
TMM10 laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
Some Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our Capabilities (TMM10)
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM10 |
| Dielectric constant: | 9.20 ±0.23 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of TMM10
| TMM10 Typical Value | ||||||
| Property | TMM10 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 | |||||
| Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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