Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | Kappa 438 |
| Final height of PCB | 0.8 mm ±0.1mm |
| Final foil external | 1 oz |
| Surface Finish | Immersion gold 0.05 micron over nickle 4.4 micron |
| Solder Mask Color | NO |
| Colour of Component Legend | NO |
| TEST | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0163-V5.6 |
| Certification | UL |
| Place of Origin | China |
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Kappa 438 RF PCB Rogers 60mil 1.524mm DK 4.38 Printed Circuit Board with
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days | Packaging Details | Vacuum |
| Glass Epoxy | Kappa 438 | Final height of PCB | 0.8 mm ±0.1mm |
| Final foil external | 1 oz | Surface Finish | Immersion gold 0.05 micron over nickle 4.4 micron |
| Solder Mask Color | NO | Colour of Component Legend | NO |
| TEST | 100% Electrical Test prior shipment | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0163-V5.6 | Certification | UL |
| Place of Origin | China |
Rogers RF PCB Built on Kappa 438 30mil 0.762mm DK 4.38 with Immersion Gold for Small Cells.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.
Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.
Features
1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements
Benefits
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible
Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters
Our PCB Capability (Kappa 438)
| PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
| Designation: | Kappa 438 |
| Dielectric constant: | 4.38 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 20mil (0.508mm) 30mil(0.762mm) 40mil(1.016mm) 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of Kappa 438 Laminate
| Property | Typical Value Kappa 438 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Design | 4.38 | Z | - | 2.5 GHz | Differential Phase Length Method |
| Dissipation Factor tan, d | 0.005 | Z | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant e | -21 | - | ppm/°C | 10 GHz (-50 to 150°C) | Modified IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2.9 x 109 | - | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 6.2 x 107 | - | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 675 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
| Tensile Strength | 16 12 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flexural Strength | 25 19 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Dimensional Stability | -0.48-0.59 | MD CMD | mm/m | - | IPC-TM-650 2.4.39a |
| Coefficient of Thermal Expansion | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| 16 | Y | ||||
| 42 | Z | ||||
| Thermal Conductivity | 0.64 | Z | W/(m.K) | 80°C | ASTM D5470 |
| Time to Delamination (T288) | >60 | - | minutes | 288°C | IPC-TM-650 2.4.24.1 |
| Tg | >280 | - | °C TMA | - | IPC-TM-650 2.4.24.3 |
| Td | 414 | - | °C | - | IPC-TM-650 2.3.40 |
| Moisture Absorption | 0.07 | - | % | 24/23 | IPC-TM-650 2.6.2.1 |
| Young’s Modulus | 2264 2098 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flex Modulus | 2337 2123 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Bow | 0.03 | - | % | - | IPC-TM-650 2.4.22C |
| Twist | 0.08 | - | % | - | IPC-TM-650 2.4.22C |
| Copper Peel Strength After Thermal Stress | 5.8 | - | lbs/in | 1 oz (35 µm) foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Specific Gravity | 1.99 | - | g/cm3 | - | ASTM D792 |
| Lead-Free Process Compatible | Yes | - | - | - |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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