Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 4 |
| Glass Epoxy | TU-768 |
| Final foil | 1.5 Oz |
| Final height of PCB | 1.6mm ±10% |
| Surface Finish | Immersion gold |
| Solder Mask Color | Green |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-503-V0.53 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 4 | Glass Epoxy | TU-768 |
| Final foil | 1.5 Oz | Final height of PCB | 1.6mm ±10% |
| Surface Finish | Immersion gold | Solder Mask Color | Green |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-503-V0.53 |
| Certification | UL | Place of Origin | China |
High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.
Main Applications
Consumer Electronics
Server, workstation
Automotive
PCB Specifications
| Item | Description | Requirement | Actual | Result |
| 1. Laminate | Material Type | FR-4 TU-768 | FR-4 TU-768 | ACC |
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | Taiwan Union (TU) | Taiwan Union (TU) | ACC | |
| Thickness | 1.2±10% mm | 1.18-1.21mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 26.15µm | ACC |
| Outer copper | 35µm | 37.85µm | ACC | |
| Inner Copper | 30µm | 31.15µm | ACC | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | PSR-2000GT600D | ACC |
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10µm | 19.55µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
| Color | White | White | ACC | |
| Location | C/S, S/S | C/S, S/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC |
| Date Code | WWYY | 0421 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC |
| Tin Thickness | ||||
| Nickel Thickness | 3-6µm | 5.27µm | ACC | |
| Gold Thickness | 0.05µm | 0.065µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 6mil | 5.8mil | ACC |
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | 30±5º | 30º | ACC |
| Residual thickness | 0.4±0.1mm | 0.39mm | ACC | |
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.32% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC |
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.58µg/c㎡ | ACC |
Our Advantages
ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
16000㎡ workshop;
30000㎡ output capability per month;
Prototype to large volume production capability
IPC Class 2 / IPC Class 3;
Any layer HDI PCBs;
Delivery on time: >98%
Customer complaint rate: <1%
Our PCB Capability (2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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