Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Glass Epoxy | PTFE F4B |
| Final foil | 1 Oz |
| Final height of PCB | 3.0 mm ±10% |
| Surface Finish | Immersion gold |
| Solder Mask Color | Black |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-107-V1.07 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
PTFE High Frequency PCB On DK2.2 Dual Layer Cheap RF PTFE PCB for Couplers
High Frequency PCB On DK2.65 PTFE Double Sided With OSP and Green Mask for
PTFE High Frequency PCB Built On 3.0mm F4B RF PCB Board for Patch Antenna
PTFE PCB Board Built On 1.5mm PTFE Plate with 3oz Copper and Immersion Silver
Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Glass Epoxy | PTFE F4B |
| Final foil | 1 Oz | Final height of PCB | 3.0 mm ±10% |
| Surface Finish | Immersion gold | Solder Mask Color | Black |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-107-V1.07 |
| Certification | UL | Place of Origin | China |
Metal Based High Frequency PCB Built on Modified Woven Fabric Glass Teflon (PTFE) Copper Clad Laminates with Ceramic Filler
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.
Parameters
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃) : -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td (℃): 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
Data Sheet of F4BTMS Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler
| Designator of Substrate | Material Composition / Dielectric Layer | Types | DK @ 10GHz & Tolerance | Thermal Change of Dk(ppm/℃) | Loss Tangent, Df@10GHz | Thermal Conductivity(W/mk) | Td (℃) | Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) | Density (g/cm3): | Volume Resisivity (Mohm.cm) | Surface Resistivity (Mohm) | Moisture Absorption (%) | Peel Strength (N/cm) (1oz) | Flammability Rating | ||
| X | Y | Z | ||||||||||||||
| F4BTMS | PTFE/Ceramic/Superfine woven glass | F4BTMS220 | 2.20±0.03 | -48 | 0.0010 | 0.35 | 476 | 40 | 45 | 98 | 1.80 | 1X108 | 1X108 | 0.02 | 20 | V-0 |
| F4BTMS294 | 2.94±0.04 | -20 | 0.0012 | 0.58 | 490 | 10 | 12 | 22 | 2.25 | 1X108 | 1X108 | 0.03 | 12 | V-0 | ||
| F4BTMS300 | 3.00±0.04 | -20 | 0.0013 | 0.58 | 490 | 10 | 11 | 22 | 2.28 | 1X108 | 1X108 | 0.04 | 12 | V-0 | ||
Type of Metal Base: Aluminum, Copper
Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm
Base copper: 0.5oz, 1oz
Thickness and size F4BTMS
| Designator of Substrate | Standard Dielectric Thickness(Without the cladding) and Tolerance | Available Copper Foil | Standard Size | |
| F4BTMS | 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) | Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. | 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper | 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48") |
Our PCB Capability (Metal based RF PCB)
| PCB Material: | Modified PTFE Copper Clad with Ceramic Filler |
| Designator: | F4BTMS220 |
| Dielectric constant @ 10GHz: | 2.2 |
| Layer count: | Single Layer |
| Copper weight: | 0.5oz, 1oz |
| PCB thickness: | 1.2mm - 9.0mm |
| 0.047” - 0.354” | |
| Solder mask: | Green, Red, Black, White, Blue etc. |
| PCB size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!