Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Board Material | FR-4 |
| Board Thickness | 2.0mm |
| Surface Cu thickness | 35 µm (1 oz) |
| Surface Finish | Immersion Gold |
| Coverlay Colour | Green |
| Color of Silkscreen | White |
| Function | 100% Pass electrical test |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-480-V6.09 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
4 Layer High Frequency PCB Built On 6.6mil and 20mil RO4350B with Blind Via for
4 Layer High Frequency PCB Built On 2 Cores of 20mil RO4350B with Back Drill for
Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B + FR4 With Blind
RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Board Material | FR-4 | Board Thickness | 2.0mm |
| Surface Cu thickness | 35 µm (1 oz) | Surface Finish | Immersion Gold |
| Coverlay Colour | Green | Color of Silkscreen | White |
| Function | 100% Pass electrical test | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-480-V6.09 | Certification | UL |
| Place of Origin | China |
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
1.1 General description
This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
1.2 Our Advantages
1. ISO9001, ISO14001, IATF16949, UL Certified;
2. Prototype to volume Production Capability;
3. 16000㎡ workshop;
4. 30000㎡ output capability per month;
5. 8000 types of PCB's per month;
6. IPC Class 2 / IPC Class 3;
7. Eligible products rate of first production: >95%
1.3 Applications of HDI PCBs
Automotive, GPS Trackers
5G WiFi, Embedded Systems Basics
Smartphones and tablets
Wearable technology and Healthcare
Access Control Solutions and Aerospace
1.4 Parameter and data sheet
| Number of Layers | 14-Layer |
| Board Type | Multilayer PCB |
| Board size | 220mm x 170mm=4PCS |
| Board Thickness | 2.0 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 18 um (0.5oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 6.2 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
1.5 Different Types of HDI PCBs
To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:
1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.
I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.
Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!