Payment Terms | T/T, Western Union, Paypal |
Supply Ability | 10Kpcs per year |
Delivery Time | 1-2 working days |
Packaging Details | Shielded Plastic Trays |
Goods Condition | Brand New |
Part Status | Active |
Lead Free / Rohs | Complaint |
Function | MCU |
Mounting Type | Surface Mount |
Package | QFP |
Brand Name | ST |
Model Number | STM32F103ZET6TR |
Certification | CE |
Place of Origin | CN |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union, Paypal | Supply Ability | 10Kpcs per year |
Delivery Time | 1-2 working days | Packaging Details | Shielded Plastic Trays |
Goods Condition | Brand New | Part Status | Active |
Lead Free / Rohs | Complaint | Function | MCU |
Mounting Type | Surface Mount | Package | QFP |
Brand Name | ST | Model Number | STM32F103ZET6TR |
Certification | CE | Place of Origin | CN |
High Light | mcu micro control unit ,integrated circuit components ,STM32F103ZET6 MCU Microcontroller Unit |
STM32F103ZET6 IC Chip MCU 32BIT 512KB FLASH 144LQFP integrated circuit
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as medium-density devices and the STM32F103xC, STM32F103xD and STM32F103xE are referred to as high-density devices. Low-density and high-density devices are an extension of the STM32F103x8/B mediumdensity devices, they are specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low-density devices feature lower Flash memory and RAM capacities, less timers and peripherals. High-density devices have higher Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I2S and DAC while remaining fully compatible with the other members of the family. The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE are a drop-in replacement for the STM32F103x8/B devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle. Moreover, the STM32F103xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.
Manufacturer | STMicroelectronics | |
---|---|---|
Series | STM32F1 | |
Packaging ![]() | Tray ![]() | |
Part Status | Active | |
Core Processor | ARM® Cortex®-M3 | |
Core Size | 32-Bit | |
Speed | 72MHz | |
Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART, USB | |
Peripherals | DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT | |
Number of I/O | 112 | |
Program Memory Size | 512KB (512K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 64K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
Data Converters | A/D 21x12b; D/A 2x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Package / Case | 144-LQFP | |
Base Part Number | STM32F103 |
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Company Details
Business Type:
Distributor/Wholesaler
Year Established:
1995
Ecer Certification:
Site Member
Koben Electronics was founded in 1995 and is located in the Silicon Valley of China, Shenzhen. The mission of Koben has always been to provide quality electronics components to manufacturers worldwide. Early on we became a primary conduit for end-of-program and overstoc... Koben Electronics was founded in 1995 and is located in the Silicon Valley of China, Shenzhen. The mission of Koben has always been to provide quality electronics components to manufacturers worldwide. Early on we became a primary conduit for end-of-program and overstoc...
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