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Shenzhen Swift Automation Technology Co., Ltd.

  • China,Shenzhen ,Chongqing
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China LAE5UM-25F-7BG381E LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192
China LAE5UM-25F-7BG381E LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192

  1. China LAE5UM-25F-7BG381E LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192

LAE5UM-25F-7BG381E LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192

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  2. Price: Negotiation
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Payment Terms TT
Supply Ability 100
Delivery Time 3-4days
Packaging Details carton box
Number of LABs/CLBs 3000
Number of Logic Elements/Cells 24000
Total RAM Bits 1032192
Number of I/O 197
Voltage - Supply 1.04V ~ 1.155V
Operating Temperature -40°C ~ 125°C (TJ)
Brand Name Original
Model Number LAE5UM-25F-7BG381E
Certification Original
Place of Origin Original

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Product Specification

Payment Terms TT Supply Ability 100
Delivery Time 3-4days Packaging Details carton box
Number of LABs/CLBs 3000 Number of Logic Elements/Cells 24000
Total RAM Bits 1032192 Number of I/O 197
Voltage - Supply 1.04V ~ 1.155V Operating Temperature -40°C ~ 125°C (TJ)
Brand Name Original Model Number LAE5UM-25F-7BG381E
Certification Original Place of Origin Original
High Light 381-FBGA Field Programmable Gate ArrayLAE5UM-25F-7BG381E LA-ECP5LAE5UM-25F-7BG381E LA-ECP5 FPGA IC

HCPL-2611-020E Logic Output Optoisolator 10MBd Schottky Clamped 5000Vrms 15kV/µs

 
Chips from factories. All are new and original. Pls inform us the part number and qty when to inquiry.

Specifications of LAE5UM-25F-7BG381E

 

TYPE DESCRIPTION
Category Integrated Circuits (ICs)
  Embedded
  FPGAs (Field Programmable Gate Array)
Mfr Lattice Semiconductor Corporation
Series LA-ECP5
Packaging Tray
Number of LABs/CLBs 3000
Number of Logic Elements/Cells 24000
Total RAM Bits 1032192
Number of I/O 197
Voltage - Supply 1.04V ~ 1.155V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 381-FBGA
Supplier Device Package 381-CABGA (17x17)
Base Product Number LAE5UM-25

 

Features of LAE5UM-25F-7BG381E


* Higher Logic Density for Increased System Integration
 * 12K to 44K LUTs
 * 197 to 203 user programmable I/Os
* Embedded SERDES
 * 270 Mb/s, up to 3.2 Gb/s, SERDES interface (ECP5UM Automotive)
 * Supports eDP in RDR (1.62 Gb/s) and HDR(2.7 Gb/s)
 * Up to four channels per device: PCI Express,Ethernet (1GbE, XAUI, and SGMII,), and CPRI
* sysDSP™
 * Fully cascadable slice architecture
 * 12 to 160 slices for high performance multiply and accumulate
 * Powerful 54-bit ALU operations
 * Time Division Multiplexing MAC Sharing
 * Rounding and truncation
 * Each slice supports
 * Half 36 x 36, two 18 x 18 or four 9 x 9 multipliers
 * Advanced 18 x 36 MAC and 18 x 18 Multiply-Multiply-Accumulate (MMAC) operations
* Flexible Memory Resources
 * Up to 1.944 Mb sysMEM™ Embedded Block RAM (EBR)
 * 194K to 351K bits distributed RAM
* sysCLOCK Analog PLLs and DLLs
 * Four DLLs and four PLLs in LAE5-45; two DLLs and two PLLs in LAE5-25 and LAE5-12
* Pre-engineered Source Synchronous I/O
* DDR registers in I/O cells
 * Dedicated read/write levelling functionality
 * Dedicated gearing logic
 * Source synchronous standards support
 * ADC/DAC, 7:1 LVDS, XGMII
 * High Speed ADC/DAC devices
 * Dedicated DDR2/DDR3 and LPDDR2/LPDDR3 memory support with DQS logic, up to 800 Mb/s data-rate
* Programmable sysI/O™ Buffer Supports Wide
Range of Interfaces
 * On-chip termination
 * LVTTL and LVCMOS 33/25/18/15/12
 * SSTL 18/15 I, II
 * HSUL12
 * LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
 * subLVDS and SLVS, MIPI D-PHY input interfaces
* Flexible Device Configuration
 * Shared bank for configuration I/Os
 * SPI boot flash interface
 * Dual-boot images supported
 * Slave SPI
 * TransFR™ I/O for simple field updates
* Single Event Upset (SEU) Mitigation Support
 * Soft Error Detect – Embedded hard macro
 * Soft Error Correction – Without stopping user operation
 * Soft Error Injection – Emulate SEU event to debug system error handling
* System Level Support
 * IEEE 1149.1 and IEEE 1532 compliant
 * Reveal Logic Analyzer
 * On-chip oscillator for initialization and generaluse
 * 1.1 V core power supply

 

 

Descriptions of LAE5UM-25F-7BG381E


The ECP5 Automotive family of FPGA devices is optimized to deliver high performance features such as
an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an
economical FPGA fabric.

 

 


Environmental & Export Classifications of LAE5UM-25F-7BG381E
 

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

 

Company Details

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,

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 and 

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 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2012

  • Employee Number:

    500~600

  • Ecer Certification:

    Verified Supplier

Shenzhen Swift Automation Technology Co., Ltd. is located in the BaoAn District of Shenzhen City,12 KM to the Shenzhen Airport and near the New Convention and exhibition center. Our business majorly covers 2 aspects: 1. Automatic Nylon Cable Tie machine and its supporting equipments. 2. Nylon Ca... Shenzhen Swift Automation Technology Co., Ltd. is located in the BaoAn District of Shenzhen City,12 KM to the Shenzhen Airport and near the New Convention and exhibition center. Our business majorly covers 2 aspects: 1. Automatic Nylon Cable Tie machine and its supporting equipments. 2. Nylon Ca...

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  • Shenzhen Swift Automation Technology Co., Ltd.
  • The 1st floor, Building C, ZhouKe Sciences Park, No 190 of Chongqing Road, Heping Community, Fuhai Street, BaoAn District, Shenzhen, China
  • https://www.automaticcabletietool.com/

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